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1

SPIE Proceedings [SPIE SPIE LASE - San Francisco, California (Saturday 22 January 2011)] High-Power Diode Laser Technology and Applications IX - Automated assembly processes of high power single emitter diode lasers for 100W in 105 μm / NA 0.15 fiber module

Pierer, J., Lützelschwab, M., Grossmann, S., Spinola Durante, G., Bosshard, Ch., Valk, B., Brunner, R., Bättig, R., Lichtenstein, N., Zediker, Mark S.

Year:

2011

Language:

english

File:

PDF, 3.50 MB

english, 2011

2

SPIE Proceedings [SPIE SPIE LASE - San Francisco, California (Saturday 22 January 2011)] High-Power Diode Laser Technology and Applications IX - Bright laser source with high-power single-mode-emitting diode laser stacked array assembly and fiber coupling

Forrer, M., Moser, H., Gisler, T., Spinola Durante, G., Pierer, J., Bosshard, C., Krejci, M., Lichtenstein, N., Zediker, Mark S.

Year:

2011

Language:

english

File:

PDF, 4.63 MB

english, 2011

3

[IEEE 2009 Third International Conference on Sensor Technologies and Applications (SENSORCOMM) - Athens, Greece (2009.06.18-2009.06.23)] 2009 Third International Conference on Sensor Technologies and Applications - An Ultra Low Power Wakeup Receiver for Wireless Sensor Nodes

Durante, Marco Spinola, Mahlknecht, Stefan

Year:

2009

Language:

english

File:

PDF, 462 KB

english, 2009

4

Liquid as template for next generation micro devices

Charmet, Jérôme, Haquette, Henri, Laux, Edith, Gorodyska, Ganna, Textor, Marcus, Durante, Guido Spinola, Portuondo-Campa, Erwin, Knapp, Helmut, Bitterli, Roland, Noell, Wilfried, Keppner, Herbert

Journal:

Journal of Physics Conference Series

Year:

2009

Language:

english

File:

PDF, 1.00 MB

english, 2009

5

[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - A mems-based gas chromatograph front-end for a miniature spectrometer

Hoogerwerf, Arno, Durante, Guido Spinola, Morse, Andrew, Morgan, Geraint, Barber, Simeon, Sheridan, Simon, Wright, Ian

Year:

2017

Language:

english

File:

PDF, 358 KB

english, 2017

6

[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Silicon Carbide Pressure Sensors for Harsh Environments

Hoogerwerf, Arno C., Durante, Guido Spinola, James, Rony Jose, Dubois, Marc-Alexandre, Dubochet, Olivier, Despont, Michel

Year:

2019

Language:

english

File:

PDF, 1.02 MB

english, 2019

7

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - A novel packaging technology for miniaturization of active long-term implantable medical devices enabling new medical applications

James, R. Jose, Gobet, J., Durante, G. Spinola, Fretz, M.

Year:

2016

Language:

english

File:

PDF, 13.75 MB

english, 2016

8

Silicon Resonator Based 3.2 W Real Time Clock With 10 ppm Frequency Accuracy

Ruffieux, D., Krummenacher, F., Pezous, A., Spinola-Durante, G.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

9

WUR-MAC: Energy efficient Wakeup Receiver based MAC Protocol

Mahlknecht, S., Durante, M. Spinola

Journal:

IFAC Proceedings Volumes

Year:

2009

Language:

english

File:

PDF, 250 KB

english, 2009

10

SPIE Proceedings [SPIE SPIE BiOS - San Francisco, California, United States (Saturday 28 January 2017)] Optogenetics and Optical Manipulation - Active implant for optoacoustic natural sound enhancement

Mohanty, Samarendra K., Thakor, Nitish V., Jansen, E. Duco, Mohrdiek, S., Fretz, M., Jose James, R., Spinola Durante, G., Burch, T., Kral, A., Rettenmaier, A., Milani, R., Putkonen, M., Noell, W., Ort

Year:

2017

Language:

english

File:

PDF, 645 KB

english, 2017

11

Wafer level packaging technology for silicon resonators

J. Baborowski, A. Pezous, G. Spinola Durante, R. Jose James, R. Ziltener, C. Muller, M.-A. Dubois

Journal:

Procedia Chemistry

Year:

2009

Language:

english

File:

PDF, 508 KB

english, 2009

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